Core Power Intelli-Module Optimized for High-Performance Computing Applications

The MPC22163-130 is a 130A, non-isolated, two-phase, step-down processor core power intelli-module designed for applications such as AI processors in OAM form factors, FPGA and ASIC core power, and PCIe accelerator cards. Available in an LGA-72 (9mmx10mmx7.65mm) package, this reduced solution size improves layout, and can improve the power delivery network by reducing the distance from the output to the load, thereby lowering I2R loss. The MPC22163-130 is scalable for many processor core power intelli-modules in parallel, with up to 2kW or more of power. It also offers increased power density and excellent efficiency with low thermal resistance.

Features:

• Integrated Two DrMOS, Inductors, FETs, and Multuiple Input Capacitors
• Above 91% Peak Efficiency at 5V V_IN and 0.8V V_OUT
• Scalable
• Independent Phase Outputs for Added Flexibility
• LGA-72 (9mmx10mmx7.65mm) Package Provides a Compact 90mm² Layout Area

Related Detail Pages:

• MPC22163-30