Minimize Noise: Arrange components on the PCB to minimize noise coupling. Keep sensitive analog components away from high-current paths and use ground planes effectively to reduce noise.

Thermal Performance: Optimize the layout for efficient heat dissipation. Place high-power components near the edges of the board to aid heatsinking and consider adding thermal vias to conduct heat away from critical components.

Signal Integrity: Maintain signal integrity by keeping traces short and direct. Minimize loop areas for critical signals to reduce the risk of electromagnetic interference (EMI) and maintain stability.

Use Proper Grounding: Implement a solid grounding strategy, ensuring a low-impedance path for return currents. Separate digital and analog ground planes and connect them at a single point to avoid ground loops.

Consideration for Switching Nodes: Pay special attention to the layout around switching nodes. Keep traces short and use proper decoupling capacitors to manage transient responses and reduce voltage spikes.